A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
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A high-tech enterprise specializing in the research and development of optical fiber communications and manufacturing.
This premium KEXINT NVIDIA/Mellanox MMS4A00 Compatible 1.6T OSFP224 2xDR4 Optical Transceiver Module represents the absolute pinnacle of high-density AI data center interconnect technology. Powered by cutting-edge Broadcom 3nm DSP (Sian3) and advanced 8x200G PAM4 modulation, it delivers unmatched low-latency data throughput with ultra-low power consumption.
Engineered specifically for next-generation InfiniBand XDR / Quantum-X800 Air-Cooled Switches, the integrated Closed Finned Top (IHS) thermal architecture ensures robust heat dissipation under extreme computing loads, eliminating I/O bottlenecks.
Featuring Dual MPO-12/APC interfaces for seamless 1310nm 500m Single-Mode Fiber (SMF) connectivity, this carrier-grade module provides network engineers with 100% full-line compatibility, rock-solid hardware stability, and exceptional ROI efficiency for elite high-performance computing (HPC) and massive AI clusters.
Product Description
NVIDIA/Mellanox MMS4A00 Compatible 1.6T OSFP224 2xDR4/DR8 8x200G PAM4 InfiniBand XDR Optical Transceiver Module(SMF, 1310nm, 500m, Dual MPO-12/APC, DOM, IHS/Closed Finned Top)
The NVIDIA/Mellanox MMS4A00 (980-9IAH1-00XM00) Compatible OSFP Optical Transceiver is a twin-port OSFP IHS/Closed Finned Top module delivering 2x 800Gb/s (1.6T) for InfiniBand XDR networks. It features a single-mode, silicon photonics–based architecture with eight parallel channels, supporting 2×DR4/DR8 transmission. Each 800G port terminates with a 4-channel MPO-12/APC connector. The module uses 200G-PAM4 electrical modulation and provides reliable short-reach connectivity up to 500 meters over eight single-mode fibers.
Built with a Broadcom 3nm DSP, this transceiver ensures ultra-low bit error rates and stable, high-speed data delivery in high-density deployments. Its IHS/Closed Finned Top design enables effective thermal management for Quantum-X800 switches, supporting both air- and liquid-cooled configurations. Seamlessly pairing with NVIDIA B300 and DGX systems, the module delivers scalable, low-latency GPU-to-GPU and GPU-to-storage connectivity, ideal for AI, HPC, and large-scale data center interconnects, unlocking the full potential of high-performance computing fabrics..
Note: "Finned-top" transceivers are now called "Integrated HeatSink" (IHS) as the cooling fins are integrated into the OSFP connector metal top. Commonly used in air-cooled switches. "Flat-top" transceivers are now called "Riding Heat Sink" (RHS) as the cooling fins ride on top of the network card or systems internal cages. This is used for both air-cooled and liquid-cooled applications for DGX, ConnectX-7, and BlueField-3 DPUS.
Product Highlights
Built-in Broadcom 3nm DSP Chip, Max. Power Consumption 25W
SiPh-Based Technology for Lower Power, Cost and Higher Density
100% Verified, Compatible with NVIDIA Quantum-X800 Switches
Designed for DGX GB300/B300 Architectures
8x 200G-PAM4 Electrical to Dual 4x 200G-PAM4 Optical Parallel
Interoperates with OSFP224-DR4-800G-FL for 2x 800G NIC
Compliant with Hot-Pluggable OSFP MSA, IEEE 802.3dj, and RoHS
Class 1 Laser Safety Compliant and DDM Supported
Specifications
| NVIDIA/Mellanox InfiniBand Compatible | MMS4A00-XM | Vendor Name | KEXINT |
| Form Factor | Twin-port OSFP IHS/Closed Finned Top | Max. Data Rate | 1600Gbps (8x 200Gbps) |
| Wavelength | 1310nm | Max. Cable Distance | 500m |
| Connector | Dual MTP/MPO-12 APC | Media | SMF |
| Transmitter Type | CW (SiPh Based) | Receiver Type | PIN |
| TX Power | -3.3~4dBm | Minimum Receiver Power | -6.3dBm |
| Power Budget | 3dB | Receiver Overload | 4dBm |
| Max. Power Consumption | 25W | Extinction Ratio | 3.5dB |
| DDM/DOM | Supported | Commercial Temperature Range | 0 to 70°C (32 to 158°F) |
| Modulation (Electrical) | 8x 200G-PAM4 | Modulation (Optical) | Dual 4x 200G-PAM4 |
| CDR (Clock and Data Recovery) | TX & RX Built-in DSP | Inbuilt FEC | Yes |
| Packaging Technology | COB (Chip on Board) Packaging | Bit Error Ratio (BER) | 6E-12 (FEC Enabled) |
| Protocols | OSFP MSA, CMIS 5.1, IEEE P802.3dj, OIF 224G-VSR | Warranty | 1 Year |
Connectivity Solutions
Features
Boosting B300 AI Cluster Performance with 1.6T OSFP224 Modules
In the NVIDIA B300 architecture, the 1.6T OSFP optical module provides high-bandwidth, low-latency connectivity between Quantum-X800 InfiniBand switches and DGX B300 servers, ensuring stable, high-speed interconnections, accelerating large-scale distributed AI training, and enhancing overall cluster efficiency. Learn more about the B300 InfiniBand solution.
100% Tested by NVIDIA Environment
The 1.6T OSFP DR8 modules are tested on NVIDIA Quantum-X800 original devices to ensure the perfect blend of product performance and reliability. Including hardware compatibility (plugging, unplugging, rebooting), software compatibility (connectivity, parameters). Check compatibility with our Optics-to-Device Compatibility Tool.
Broadcom 3nm DSP & SiPh-Based Technology for Superior Energy Efficiency
Powered by Broadcom's 3nm DSP and silicon photonics chip, this 1.6T XDR transceiver delivers low power consumption of 25W (over 25% power savings) and a tight 6E-12 BER (with FEC Enabled). It enables higher port density, reduced cooling requirements, and lower total cost of ownership.
XDR vs. NDR: Ultra-Large AI Cluster Efficiency Breakthrough
XDR solution featuring the 1.6T transceiver boosts cluster energy efficiency through high bandwidth density and an optimized link architecture. In 512-node configurations, this solution enables unmatched throughput, advanced scalability, significantly reduced power and space requirements, and a 40.52% cut in total costs.
Comprehensive Testing Increases Reliability
Qualified through a rigorous process with advanced equipment to ensure you get high-quality and reliable optics.
Reliable Test Result
Professional testing ensures stable, reliable optics with verified hardware and software compatibility, including connectivity, BER, and key operating parameters. View the full test report for details.
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